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Sockets for ICs, Transistors(23290)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Type | Features | Base Product Number | Termination | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | ECCN | HTSUS | Standard Package | Current Rating (Amps) | Housing Material | Material Flammability Rating | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Pitch - Post | Contact Material - Post | Termination Post Length | Contact Resistance |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
116-93-952-41-008000 | 21.9039 |  |
1857 | 0.00000000 | Mill-Max Manufacturing Corp. | 116 | Tube | Active | -55°C ~ 125°C | Through Hole | DIP, 0.9" (22.86mm) Row Spacing | Elevated, Open Frame | 116-93 | Solder | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 7 | 3 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 200.0µin (5.08µm) | 52 (2 x 26) | Beryllium Copper | 0.100" (2.54mm) | Brass Alloy | 0.108" (2.74mm) | - | |
|
522-13-101-13-061001 | - | |
8851 | 0.00000000 | Mill-Max Manufacturing Corp. | 522 | Bulk | Active | -55°C ~ 125°C | Through Hole | PGA | Open Frame | 522-13 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 101 (13 x 13) | Beryllium Copper | 0.100" (2.54mm) | Brass Alloy | 0.370" (9.40mm) | 10mOhm | |
|
116-41-632-41-007000 | 16.9330 | |
3811 | 0.00000000 | Mill-Max Manufacturing Corp. | 116 | Tube | Active | -55°C ~ 125°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Elevated, Open Frame | 116-41 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 12 | 3 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | 0.100" (2.54mm) | Brass Alloy | 0.402" (10.21mm) | 10mOhm | |
|
522-13-096-11-041003 | - | |
8719 | 0.00000000 | Mill-Max Manufacturing Corp. | 522 | Bulk | Active | -55°C ~ 125°C | Through Hole | PGA | Open Frame | 522-13 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 96 (11 x 11) | Beryllium Copper | 0.100" (2.54mm) | Brass Alloy | 0.370" (9.40mm) | 10mOhm | |
 |
243-16-1-03 | 0.3700 | |
6 | 0.00000000 | CNC Tech | - | Tube | Active | -40°C ~ 105°C | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Open Frame | 243 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 30 | 1 A | Polybutylene Terephthalate (PBT), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Tin | 60.0µin (1.52µm) | 16 (2 x 8) | Phosphor Bronze | 0.100" (2.54mm) | Phosphor Bronze | 0.124" (3.15mm) | 20mOhm | |
 |
40-C182-10 | 10.3400 | |
20 | 0.00000000 | Aries Electronics | EJECT-A-DIP™ | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Closed Frame | 40-C182 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 40 (2 x 20) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | |
 |
28-516-11 | 16.2200 | |
13 | 0.00000000 | Aries Electronics | 516 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP) | Closed Frame | 28-516 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 13 | 1 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.150" (3.81mm) | - | |
 |
346-93-123-41-013000 | 4.5700 | |
3820 | 0.00000000 | Mill-Max Manufacturing Corp. | 346 | Bulk | Active | -55°C ~ 125°C | Through Hole | SIP | - | 346-93 | Press-Fit | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 200.0µin (5.08µm) | 23 (1 x 23) | Beryllium Copper | 0.100" (2.54mm) | Brass Alloy | 0.175" (4.45mm) | - | |
 |
116-83-636-41-011101 | 6.0224 | |
6601 | 0.00000000 | Preci-Dip | 116 | Bulk | Active | -55°C ~ 125°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Elevated, Open Frame | 116-83 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 11 | 1 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | - | 36 (2 x 18) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | 10mOhm | |
|
36-6552-18 | 124.8943 | |
4157 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | -55°C ~ 250°C | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 36-6552 | Solder | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 7 | 1 A | Polyetheretherketone (PEEK), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 36 (2 x 18) | Beryllium Nickel | 0.100" (2.54mm) | Beryllium Nickel | 0.110" (2.78mm) | - |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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